簡體中文
Japanese
Bonding Sheet
Feature：Excellent peel strengthExcellent chemical resistanceGood electrical pr
Feature：
Excellent peel strength
Excellent chemical resistance
Good electrical property
Good thermal shock
Excellent chemical resistance
Good electrical property
Good thermal shock
產品特性(FCCL Characteristic)：
Note:1. Data shown above are nominal values for reference only，Details see Certification of Quality|
特性 property |
單位 Unit |
條件 Condition |
標準 Standard |
ABXSXX15XX | ABXSXX25XX |
測試方法 Test method |
| Release Film | ||||||
| Adhesive | ||||||
| Release Film | ||||||
| Peel Strength |
Kgf/cm (90?) |
normal |
H mil≧0.8 1 mil≧1.0 |
1.4~1.7 | 1.5~1.9 | IPC-TM-650 2.4.9 |
| Solder Float Resistance | --- | 270℃/10sec | No Change Appearance | Pass | Pass | IPC-TM-650 2.4.13 |
| Chemical Resistance | % | NaOH | ≦20 | 2~4 | 2~4 | IPC-TM-650 2.3.2 |
| % | HCI | 3~5 | 3~5 | |||
| % | IPA | 1~3 | 1~3 | |||
| Volatile Content | % | 150℃/30min | ≦2 | 0.5~0.7 | 0.6~0.9 | IPC-TM-650-2.3.37 |
| Moisture Absorption | % | D-24/23 | ≦6.0 | 2.4~2.8 | IPC-TM-650 2.6.2 | |
| Resin Flow | mm | A | ≦0.15 | 0.11~0.13 | IPC-TM-650-2.3.17.1 | |
2. Storage Condition：Vacuum Packaging: Below 25℃ for 6 months，
Normal Packaging : Below 25℃,below 70% RH for 6 months.
Fast Lamination
² Prepressing Time：10sec
² Pressing Time：80~120sec
² Lam Temp：180°C
² Lam Pressure：100~120kgf